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Electronic Chemicals: PCB Chemicals and Semiconductor Packaging Materials

Specialty Chemicals Update Program

Table of Contents

Section Page Number

Executive summary 12
Summary 13
North America 20
Western Europe 20
Japan 21
China 21
South Korea 21
Taiwan 21
Other Asia 22
Introduction 23
Abbreviations 25
Overview of the PCB industry and the semiconductor packaging industry 26
PCB industry 26
PCB markets 27
Semiconductor packaging industry 28
Semiconductor packaging markets 29
United States 30
Industry structure 30
Industry market trends 31
Western Europe 32
Industry structure 32
Industry market trends 33
Japan 35
Industry structure 35
Industry market trends 36
China 36
Industry structure 36
Industry market trends 39
South Korea 41
Industry structure 42
Industry market trends 42
Taiwan 42
Industry structure 42
Industry market trends 43
Other Asia 43
Industry structure 43
Industry market trends 43
Overview of the PCB and semiconductor packaging chemicals industry 45
Structure of the industry 45
United States 45
Western Europe 47
China 51
South Korea 52
Taiwan 54
Company profiles 55
DuPont 55
MacDermid Alpha Electronics Solutions 57
Rogers Corporation 57
Hitachi Chemical Co., Ltd. 58
Sumitomo Bakelite Co., Ltd. 60
Operating characteristics 62
Research and development 62
Manufacturing 63
Marketing and technical service 63
Cost structure and profitability 64
Government regulations 66
United States 66
Western Europe 66
RoHS/WEEE directives 66
REACH Regulation 67
Japan 68
China 69
Other Asia 70
Trends and opportunities 70
Technology 70
Business 71
Critical factors for success 72
Product types and markets 75
Products and functions 75
PCB chemicals and materials 75
PCB substrates and materials 77
PCB resists 77
PCB etchants 78
PCB plating chemicals 78
Thick film pastes and solder pastes 79
Semiconductor packaging materials 81
Substrates 82
Encapsulants 82
Dieattach materials 83
Other 83
Technology and manufacturing 84
PCB chemicals and materials 84
PCB substrates and materials 84
PCB resists 85
PCB etchants 86
PCB plating chemicals 86
Thick film pastes 88
Semiconductor packaging materials 88
Substrates or interposers 88
Encapsulants 89
Dieattach materials 89
Markets by region 91
United States 91
Summary 91
PCB chemicals and materials 91
PCB substrates and materials 91
Consumption and markets 91
Market participants 93
Prices 96
Future trends and strategic issues 96
PCB resists 96
Consumption and markets 96
Market participants 97
Prices 97
Future trends and strategic issues 98
PCB etchants 98
Consumption and markets 98
Market participants 98
Prices 99
Future trends and strategic issues 99
PCB plating chemicals 99
Consumption and markets 99
Market participants 100
Prices 101
Future trends and strategic issues 101
Thick film pastes 102
Consumption and markets 102
Market participants 103
Prices 105
Future trends and strategic issues 105
Semiconductor packaging materials 106
Substrates 107
Consumption and markets 107
Market participants 108
Future trends and strategic issues 108
Encapsulants 109
Consumption and markets 109
Market participants 109
Prices 109
Future trends and strategic issues 109
Dieattach materials 110
Consumption and markets 110
Market participants 110
Prices 111
Future trends and strategic issues 111
Other 111
Western Europe 111
Summary 111
PCB chemicals and materials 112
PCB substrates and materials 113
Consumption and markets 113
Market participants 114
Prices 114
Future trends and strategic issues 115
PCB resists 116
Consumption and markets 116
Market participants 117
Prices 118
Future trends and strategic issues 119
PCB etchants 119
Consumption and markets 119
Market participants 119
Prices 120
Future trends and strategic issues 120
PCB plating chemicals 120
Consumption and markets 120
Market participants 121
Prices 121
Future trends and strategic issues 122
Thick film pastes 122
Consumption and markets 122
Market participants 123
Prices 123
Future trends and strategic issues 123
Semiconductor packaging materials 124
Substrates 125
Consumption and markets 125
Prices 126
Encapsulants 126
Consumption and markets 126
Market participants 127
Prices 127
Future trends and strategic issues 127
Dieattach materials 128
Consumption and markets 128
Market participants 128
Prices 128
Future trends and strategic issues 128
Japan 129
Summary 129
PCB chemicals and materials 130
PCB substrates and materials 130
Consumption and markets 130
Market participants 132
Prices 134
Future trends and strategic issues 135
PCB resists 136
Consumption and markets 136
Market participants 138
Prices 138
Future trends and strategic issues 139
PCB etchants 139
Consumption and markets 139
Market participants 140
Prices 140
Future trends and strategic issues 141
PCB plating chemicals 141
Consumption and markets 141
Market participants 142
Prices 143
Future trends and strategic issues 143
Thick film pastes 143
Consumption and markets 143
Market participants 144
Prices 144
Future trends and strategic issues 145
Semiconductor packaging materials 145
Substrates 145
Consumption and markets <span style=">145
Market participants 145
Prices 146
Future trends and strategic issues 146
Encapsulants 147
Consumption and markets 147
Market participants 147
Prices 148
Future trends and strategic issues 148
Dieattach materials 148
Consumption and markets 148
Market participants 149
Prices 149
Future trends and strategic issues 150
Other 150
China 150
Summary 150
PCB chemicals and materials 151
PCB substrates and materials 151
Consumption and markets 151
Market participants 153
Prices 154
Future trends and strategic issues 154
PCB resists 155
Consumption and markets 155
Market participants 156
Prices 156
PCB etchants 157
Consumption and markets 157
Market participants 157
Prices 157
Future trends and strategic issues 158
PCB plating chemicals 158
Consumption and markets 158
Market participants 158
Future trends and strategies 159
Thick film pastes 159
Market and consumption 159
Market participants 160
Price 160
Semiconductor packaging materials 160
Substrates 161
Consumption and markets 161
Market participants 161
Encapsulants 163
Consumption and markets 163
Market participants 163
Prices 165
Future trends and strategic issues 165
Dieattach materials 166
Other 167
South Korea 167
Summary 167
PCB chemicals and materials 168
PCB substrates and materials 168
Consumption and markets 168
Market participants 169
Future trends and strategic issues 170
PCB resists 170
Consumption and markets 170
Market participants 170
Prices 171
Future trends and strategic issues 171
PCB etchants 171
Consumption and markets 171
Market participants 172
Prices 172
Future trends and strategic issues 172
PCB plating chemicals 172
Consumption and markets 172
Market participants 173
Prices 174
Future trends and strategic issues 174
Thick film pastes 174
Consumption and markets 174
Market participants 175
Prices 175
Future trends and strategic issues 175
Semiconductor packaging materials 175
Substrates 175
Consumption and markets 175
Market participants 176
Prices 176
Future trends and strategic issues 176
Encapsulants 176
Consumption and markets 176
Market participants 177
Prices 177
Future trends and strategic issues 177
Dieattach materials 178
Consumption and markets 178
Market participants 178
Prices 178
Future trends and strategic issues 179
Other 179
Taiwan 179
Summary 179
PCB chemicals and materials 180
PCB substrates and materials 180
Consumption and markets 180
Market participants 180
Future trends and strategic issues 181
PCB resists 182
Consumption and markets 182
Market participants 182
Prices 183
Future trends and strategic issues 183
PCB etchants 183
Consumption and markets 183
Market participants 184
Prices 184
Future trends and strategic issues 184
PCB plating chemicals 185
Consumption and markets 185
Market participants 185
Prices 186
Future trends and strategic issues 186
Thick film pastes 186
Consumption and markets 186
Market participants 186
Prices 187
Future trends and strategic issues 187
Semiconductor packaging materials 187
Substrates 187
Consumption and markets 187
Market participants 188
Prices 188
Future trends and strategic issues 188
Encapsulants 188
Consumption and markets 188
Market participants 189
Prices 189
Future trends and strategic issues 189
Dieattach materials 190
Consumption and markets 190
Market participants 190
Prices 190
Future trends and strategic issues 190
Other 191
Other Asia 191
Summary 191
PCB chemicals and materials 192
Consumption and markets 192
Market participants 194
Prices 194
Future trends and strategic issues 194
Semiconductor packaging materials 194
Consumption and markets 194
Market participants 196
Prices 196
Future trends and strategic issues 196
Revisions 198
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